Stainless steel workbench with ultrasonic bath for the removing of photoresisted silicon-wafers. ...

Condition Good Year of Manufacture 2016 Exterior Dimensions Width 84.134 in (213.7 cm) Depth 5...

- Ultra High Resolution - Accelerating Voltage: 30 kV - Magnification: 500,000x Performance -...

Description:PC Controlled IC Back-side Lapping and Wafer Grinding System Version:200 mm and pack...

The Ohmiker-80B System is specifically designed for high throughput and long-term reliability pe...

- Technic special customized for Infineon? no - Any damages/deficits known? no - Manuals existing...

Description LASER CLEANING_HANMI LASER CLEANING 1.0_HLC001 Accessories 2 X Buffer and Vacuum box...

Condition Good Year of Manufacture 2003 Exterior Dimensions Width 145.669 in (370.0 cm) Depth ...

Model Convection Reflow Oven Description REFLOW OVEN soldering station Year of Manufacture 2016...

Condition Fair Year of Manufacture 2005

Wafer Size: 4", 6"

FUJI AIMEX III C With H24G headx2pcs and 10pcs 8mm feeder H08M head x 2 with Tray unit 10pcs 8mm...