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2010 Agilent 7500A ICP-MS
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Agilent7500a ICP-MS Common Features of All 7500 Series Systems • Compact benchtop design permit...
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LAM TCP9600 Etch
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- 2EA (Etch 1EA, Asher EA) - In Working Fab - As-is Wafer size: Present use: 4inch, (expandabl...
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TEL Interface module for Mark8
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Wafer size: 8" Condition: as is Parts
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2014 Hermann Ultrasonics HiQ dialog 1200 speed control ultrasonic welder 1200Watts @ 35Khz
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HiQ DIALOG SpeedControl The HiQ DIALOG ultrasonic welders feature the HMC pneumatic drive system...
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West-Bond 7372E Convertible Epoxy/Eutectic Die Bonder
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Unlimited deep reach access to remote bond targets on large packages with throatless chassis and ...
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West-Bond 7372E Convertible Epoxy / Eutectic Die Bonder (7200E Ver.2.40)
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This West-Bond 7372E Convertible Epoxy / Eutectic Die Bonder (missing nameplate) looks to be in g...
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TEL Interface module for Mark7
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Wafer size: 8" Condition: as is Parts
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1996 AMAT CenturaHDP→5300Omega
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2ch:SiO2 D/E CH-A/B Wafer size: 8" Condition: as is Dry etch
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1995 Karl Suss MA150
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Aligner Wafer size: 4" Condition: as is
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2007 TEL Indy-B-L
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D-Poly Furnace Wafer size: 12" As-is, Initialed HDD included Vintage: 2006 (1) 2007 (1)
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Veeco UNITY AP300-IW
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C4, expose, widefield
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Veeco SATURN SPEC 300
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Expose tool, SIP
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