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The HPC is for the solvent lift off process – 500-2300psi / The cleaning of the Wafers takes plac...

Part Dev 3-3 Exhaust/Drain Manifold - Module Area for Tel Act 8 Qty. 1 Height .17 Mtrs Width ...

Ambient temp, and x8 test sights

Dual Temo with x4 test sights

Part Dev 3-2 Dispense Line/Water Jacket H Nozzle Assembly, Dev 3-2 Exhaust/Drain Manifold - Modul...

Part Dev 3-1 Dispense Line/Water Jacket H Nozzle Assembly, Dev 3-1 Exhaust/Drain Manifold - Modul...

Part Dev 3-X Dev Solution/Motor Flange Cooling Water Temp Sensors x 4 for Tel Act 8 Qty. 4 Heig...

Wire bonder 160 units available 20 units are 2009 and the rest are 2010-2011

Applied Materials P5000 Etcher 6" Configuration: - 2 MxP + Chambers (vintage 1995)

- Software version: 7.5 gem - MW Power: 1.25kw (Model C12935) - Gas: 2 gas O2 & N2 - Brooks Zb...