2006 SSEC M3303 Lift off Process
2006 SSEC M3303 Lift off Process
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Description
The HPC is for the solvent lift off process – 500-2300psi / The cleaning of the Wafers takes place in the HVS (high velocity spray) chamber up to 40psi
Specifications
| Manufacturer | SSEC |
| Model | M3303 Lift off Process |
| Year | 2006 |
| Condition | Used |
| Stock Number | GOD23082023720223437 |