AMAT P-5000 Mark II MxP Poly

Polysilicon Etch

Etch/Ash/Clean - Plasma Processing

Currently Configured for: 200mm

Current Equipment Status: Available

Available date: Currently Available

Software: 4.8_26

MF: P5000 Mark II

Qty 4 - MxP Poly

ESC: Polymide

Gases Used: SF6, HE, CHF3, AR, N2, CF4, O2, HBR, CL2, HE/O2

MFCs: 26 DIgital MFC's Unit or Horiba

Robot: ROBOT ASSY 8 IN AMAT 5000

Dry Pumps:

1-BA100, 2 DS80/250, 

2-IQDP80/WSU151

Chillers:

3-Neslab 150, 1-AMAT-0