Marpet Enterprises MEI 1204B hybrid ball bonder

The MechEl / MEI 1204 is available in two configurations The MEI 1204B (Ball Bonder) and MEI 1204W (Wedge Bonder). Both the MEI 1204B and W will handle wire sizes from 0.0007” (17um) to 0.003” (75um) and are available with a full line of work holder and options to fit all applications.

SPECIFICATIONS: 

Bonding Processes:Thermocompression or thermosonic ball bonding using gold wire.Wire sizes: 1 mil (25 micron) wire standard.  0.7 mil (18 micron), 2 mil (51 micron), and 3 mil (76 micron)

capability available.Tip Weight:15 - 150 grams.Capillary size:0.063" x 0.375" (1.6mm x 9.5 mm) standard.Heated Workstage:Digital heat control option will regulate temperature from ambient to 300°C +/- 0.5% (dependant 

upon application).Ultrasonics:Uthe 10G generator with 25ST transducer standard.Micropositioner:6:1 standard.  Services:Electrical: 110-115 VAC, 50/60Hz, 5 amps or 220-240 VAC, 50/60Hz, 2.5 amps. 

Air: 40 PSI (240 kPa) minimum, if required.

Vacuum: 20" (510 mm) Hg minimum, if required.

Dimensions:  Length: 12.0" (30.5 cm)

Width: 18.0" (45.7 cm)

Height 17.75" (45.1cm)

Net Weight: 50 pounds (23 Kg)

*Note: Exact dimensions are dependent upon the options on the machine.