TEL ACT-12_3C4D

Coater/ developer

No missing/ complete

De-installed

Manufacturer: TEL ACT12-300 Dual Block Track

Tool Type: Dual Process Block Track

Model: ACT12-300

Wafer Size: 300mm

Direction: RIGHT HAND SIDE

4 Blocks Interfaced; Cassette, 2 Process, & Stepper Interface

4 Wafer Transfer Robot Arms; Cassette, 2 Process, & Stepper Interface

Control Module on cassette end station (CES)

3 Station 25 wafer FOUP

Interface is to Ultratech T-300

Cassette rotators and platforms

Facility sensors for DI water and Caustic exhaust

Coater (COT) - quantity 1

Coater (PCT) - quantity 2

 2 Nozzles w/ Temperature Control

 Chuck vacuum sensor

 Millipore P-250 pumps

 SS 0.3mm diameter side rinse nozzle w/ flow meter

 1 set of 2 SS 0.3mm diameter back rinse nozzles

 1 SS 0.3mm diameter back rinse nozzle for chemical 1

 1 SS 0.3mm diameter back rinse nozzle for chemical 2

 Bulk-FSI system for side and back rinse

 PTI mass flow controller per module

 PP cup w/ sensor

 Chuck Up VAC Off Switch

 Addition of drip trays

Developer (DEV) - quantity 4

 1 “H” nozzle w/ temperature control per cup

 Bulk-FSI system for developer

 PP cup w/ sensor

 Chuck vacuum sensor

 Chuck Up VAC Off Switch

Chill Plate Process Station (CPL) - quantity 6

 Hard anodized aluminum oxalic acid treated surface plate AL

 Temperature Control

 0.1 mm C ring fixed type and spacer type stainless & polyimide proximity pins

 Dual-Band alarm function

Transfer Chill Plate (TCP) – quantity 1

 Hard anodized aluminum oxalic acid treated surface plate Al

 0.1mm C ring fixed type and spacer type stainless & polyimide proximity pins

Adhesion Process Station (ADH) – quantity 1

 Half-sealed chamber w/ dispersion plate for HMDS

 Dual-band alarm function

 10L canister w/ Bubble sensor

Heated Cover High Exhaust Low Temp Hot Plate Process Station (HCH) - quantity 8

 N2 purge capability

 High volume exhaust

 Mist traps

 SS insulated heated exhaust cover w/ cover interlock

 Hard anodized aluminum oxalic acid treated Al surface plate

 Temperature control

 0.1mm C ring fixed type and spacer type stainless & polyimide proximity pins

 Dual-band alarm function

 Individual thermo-switch for overheating detection

Interface Block - quantity 1

 Single-pincette shared wafer transfer w/ centering guides; standard wafer arm and interface panel to accommodate Ultratech T-300 (May vary)

 Interface must include a CPL for insuring consistent wafer temps into the stepper; (IFCPL)

 Buffer cassette; 26 wafer capability

 Wafer out sensor

 WEE requires 435nm spectrum for G-line application

TEL Temperature and Humidity Controller - 2

Fluid Temperature Controller – 1

Chemical Cabinet – 1

 DI H20 facility sensors

 4- 1gal C4 bottles w/ recirculation feature

 2- 20L reserve Tank s w/ 2- 3L buffer tanks for solvent

 2- 20L reserve Tank s w/ 2- 3L buffer tanks for develop

 300cc L/E for solvent

 8- 200cc L/E for C4

 1- Solvent panel

 1- Develop panels

 2- auto change air valves

AC Power Box – 1