2018 STS / SPTS Versalis fxP Etcher

- It is configured for autoloading 200mm wafers
- It has two process chambers:
- CVE – XeF2 etch chamber (isotropic etching of Si)
- CVD – oxide, nitride, and silicon
- It does not have the Rapier chamber to run the DRIE Bosch process.
2018 Vintage