2004 Oxford PlasmaLab System 133+ RIE CL Reactive Ion Etcher

2004 Oxford PlasmaLab System 133+ RIE CL Reactive Ion Etcher

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Description

Was refurbished with OEM specifications

Configuration:

Supports wafer sizes up to 300mm (330mm Platen)

Mechanical chuck

RIE set up for GaN Etch

RF Power: 600W, 13.56MHz

Water cooled electrode 10C-80C

End point detection: Verity Optical emission spectroscopy (200-800nm)

Gas pod with 8 lines including following 7 MFCs:

  • Ar – 100sccm
  • CL2 – 100sccm
  • BCL3 – 100sccm
  • N2O – 200sccm
  • CHF3 – 200sccm
  • NH3 -100sccm
  • CH4 – 50sccm

Windows PC, user friendly interface GUI

This tool was removed from production October 2014.

Specifications

ManufacturerOxford PlasmaLab System
Model133+ RIE CL Reactive Ion Etcher
Year2004
ConditionRefurbished
Stock NumberBM3502