AMAT Centura II

General Information Selected Option

 Technology POLY ETCH

 Platform Type CENTURA AP

Wafer Specification Selected Option

 Wafer Size 200mm

 Wafer Shape SNNF

Chamber Type/Location Selected Option

 Position A (D4) SILICON DPS II CHAMBER

 Position B (D4) SILICON DPS II CHAMBER

 Position C (D4) SILICON DPS II CHAMBER

 Position D (AXP) SILICON AXIOM HT CHAMBER

Transfer Chamber & FI Selected Option

 Robot Blades Transfer Chamber Blade 2EA (BUFFER BLADE)

 Robot Blades FI Blade 2EA

CHAMBER A,B,C SILICON DPS II CHAMBER 

Silicon DPS II Chamber Options Selected Option

 Gas Nozzle Type TUNABLE GAS NOZZLE

SAPPHIRE WINDOW,IEP 300mm OPS2 SAPPHIRE WINDOW,IEP 300mm OPS2

CHAMBER D (AXP) SILICON AXIOM HT CHAMBER

CH D Process kit

 Heater (DXZ 200mm) Conversion Kit (300mm to 200mm)

 SAPPHIRE LIFT PIN 200MM ASP ETCH Conversion Kit (300mm to 200mm)