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SSEC 3302
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LTX Credence Fusion MxC
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Tester
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Tokyo A WD 200 T
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Type: Wafer Dicing Machine Equipment Configuration: – 1 spindle down
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Rheometric DMTA-V
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Fujikura FSM 30 R
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Type: ARC Fusion Splicer
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2003 TEL FORMULA
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Wafer size: 300mm Category: diffusion Process: ALO Furnace Pics 1-8 = tool 1 Pics 9-16 = tool 2
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Carbolite HT 628 CR 2416 OTC
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Type: High Temperature Convection Oven Equipment Configuration: With: – Eurotherm E3508P1 Digit...
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Plasma Etch BT 1
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Equipment Configuration: – set up for oxygen plasma cleaning of aluminum parts
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Lyncee Tec DHM R 2100
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Zeiss ZSML 200
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Ramgraber IPA
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Type: Isopropanol Vapor Dryer Equipment Configuration: – set up for 100mm wafer boats
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ESEC 3088
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Type: Wire Bonder
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