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Nanometrics 9010 Lithos
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Wafer size: 300mm Semiconductor Fabrication Metrology Equipment CD Measurement System
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Manufacturing Integration Technology, Ltd (MIT) SmartFlex 933
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Semiconductor Assembly & Packaging Tape and Reel Equipment Tape & Reel Handler
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Manufacturing Integration Technology, Ltd (MIT) LinearFlex 832
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Semiconductor Assembly & Packaging Tape and Reel Equipment Tape & Reel Handler
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LAM 2300 Exelan Flex
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Semiconductor Fabrication Etch Equipment Oxide Etch System Wafer size: 300mm
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Kulicke & Soffa Maxum Ultra
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Semiconductor Assembly & Packaging Bonding Equipment Ball Wire Bonder
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Semiconductor Assembly & Packaging Bonding Equipment Ball Wire Bonder
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Kokusai Quixace 2
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Wafer size: 300mm Semiconductor Fabrication Traditional Furnaces / Diffusion Systems Vertical ...
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Kokusai Quixace
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Wafer size: 300mm ULT-SiO2 Process Traditional Furnaces / Diffusion Systems Vertical Furnace
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Kokusai ADVANCED ACE 300
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Wafer size: 300mm Vertical Furnace RTP Equipment Semiconductor Fabrication Rapid Thermal Proce...
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GPD PBFT-856VS
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Semiconductor Assembly & Packaging Tape and Reel Equipment Tape Peel Analyzer
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ESEC 2008HSE+
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Semiconductor assembly & packaging Bonding equipment Epoxy die bonder
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ECI Technology QL10E
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Chemical/Gas Treatment System Semiconductor Fabrication
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