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Blue M Oven DCC 206CY
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Temp 250 Deg C Voltage:240 Still installed
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Esec 2008XP x2set Die Attach
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wafer size setup : 8inch package : IC package setup Input : stack leadframe output : magazine Dis...
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ASM AD809A-03 x1set
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Die Bonder
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ASM AD809S-00 x3sets
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ASM AD809C-00 x2sets
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ASM AD809M-06 x3sets
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ASM AB Eagle60
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K&S8028S x5sets
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Wire Bonder
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K&S8028PPS x5sets
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ISMECA D2 tape and reel for D2 pack
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ISMECA D2 tape and reel for D2 pack
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Hughes 2460-II hybrid bonder, 4?x4?
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Hughes 2460-II hybrid bonder, 4?x4?
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Heraeus HEP 21 burn-in system
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Heraeus HEP 21 burn-in system
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