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2007 Datacon 2200 apm Die Bonder
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Description Multi-Chip Die Bonder Condition Very Good Year of Manufacture 2007
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2012 Shibuya SBP 660 Ball Placement
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Condition: Like new, as it's only used for R&D for a WLCSP
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2005 Datacon AMP2200
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Double Cabin Machine type one Controller.
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West-Bond 545657B Convertible Semi-Automatic 5600B 90° Feed Wedge Bonder
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This West-Bond 545657B is a Semi-Automatic Three-Way Convertible 45° Wire Feed Wedge, 90° Wire & ...
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2009 ASM AD830
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Sold in working condition
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ASM BP2000 ball mounter
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2009 ASM Die bonder AD838L
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Vintage: 2009
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Shinkawa wire bonder UTC-200K
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Model : UTC-200K Vintage : 2006/7 units,2005/4 units Total QTY : 11 units Condition : Off line
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Dage Multitest 22 pull tester
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SHINKAWA UTC-100
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Model : UTC-100 Vintage : 1992/1 unit,1994/1 unit Total QTY : 2 units Condition : Off line
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2002 SHINKAWA UTC-400BI
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Model : UTC-400BI Vintage : 2002/1 unit Condition : Off line
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