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Vintage: 2017 Option: BBD, NCS Working hours: 2457 hours Good condition Spindle: 1.8kw

Vintage: 2013 Option: BBD, NCS Working hours: 8500 hours Good Condition Spindle: 18kw

DISCO DTG8440 TAIKO wafer grinder VINTAGE 2009 CONDITION excellent

Good complete condition Vintage: 2012 Wafer Size: Runs up to 200mm

- 1.8KW Spindle- NCS & BBD- High/low resolution microscope- 8” chuck table, has 6” table but extr...

Dicing saws, used for 6" wafer Used

Dicing Tool Used

Automatic Dicing Saw, Tool

Vintage 2012 CE Marked NCS: Yes BBD: Yes 6 or 8 inch chuck available

Process Laser saw Vintage 2009 Wafer Size 8 inch ( Max Workpiece Size 12 inch) Voltage 200~240...

It’s still running at a fab. Working Condition. Laser: Hamamatsu Stealth dicing SDE 03 Laser h...

Still running at a fab. Working Condition. Laser: Hamamatsu Stealth dicing SDE 03 Laser hours:...