ESEC 2008HS3 Plus

ESEC 2008HS3 Plus

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Description

 ESEC 2008HS3 Plus Die Bonder refurbished condition

Configuration – 12” wafer table,

Writing dispenser,

TOS input,

Magazine output,

wafer map,

OBC,

PostIQC.

 


Specifications

ManufacturerESEC
Model2008HS3 Plus
ConditionUsed
Stock Numberem2375