2017 Finetech FINEPLACER LAMBDA Sub-Micron Die bonder with 0.5um accuracy

2017 Finetech FINEPLACER LAMBDA Sub-Micron Die bonder with 0.5um accuracy

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Description

Includes:


FINEPLACER lambda


Bonding force module FD3


Chip heating module


Optional Dispensing Module FG3


WinFlipChip software version 3.2 Revision 052 and PC


manufacture date 2017

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Specifications

ManufacturerFinetech
ModelFINEPLACER LAMBDA Sub-Micron Die bonder with 0.5um accuracy
Year2017
ConditionUsed
Stock NumberBM5065