2022 EVG 560 Bonding System

EVG 560 AUTOMATED PRODUCTION WAFER BONDING SYSTEM consisting of:

- Fully automated operation

- Interlocked doors with signal light tower

- 4 Axis Industrial Robot

- EVG CIM Framework Software GUI (Graphical User Interface)

- Flexible process flow definition

- Drag and drop recipe programming

- Parallel processing of multiple jobs

- Automated recording of process and machine parameters

- Throughput optimized handling sequence

- Password protected user access levels

- FOUP loading with empty/present sensor

- Currently configured for 8" (200mm) wafers 

- Bond chuck included for 8" wafers, additional chucks can be offered

- Mechanical Alignment Module 

- 1 Bond module with up to 550°C

- 1 UV Cure Bond module 

- 1 Inline inspection metrology tool

- CE Certified

- System documentation

- Vintage: 2022

Condition:

Used

Condition:

Operational, installed in fab. 

Being Sold in As-Is / Where-Is Condition.