Veeco AP 300 E Lithography System

- 2.0 um, Extended Field, ghi-line Broadband Lens Dual 1200 Watt Lamp llluminator

- 68 x 26 mm Field Size

- Lens Distortion Reference - No lens matching - Closed Loop Cooler

- Lens Protection (Requires Closed Loop Cooler)

- Universal Size/Warped Wafer Kit: 200 mm and 300 mm

- Warped Wafer Handling to 500 um

- FOUP Wafer Handling

- Wafer Thickness Handling from 0.4 mm to 2.0 mm PATMAX MVS Alignment System

- MVS Alignment Spectrum of 530 - 570 nm

- 6 Slot Reticle Stack, Manual Front Loading

- 6 x 6 x 0.25 inch Reticle Type

- Dual Flip Aperture: ([68mm/44mm/34.2mm] x 26mm)

- Enhanced Bottom Pellicle

- Power Source: 208 V three phase, 5 wire, 150 amp

- Environmental Chamber, Shipped From Supplier (White)

- GEM HSMS Communications

- ghi-line Auto Filter Changer

- Open Cassette Adapter (QTY 2)

- Edge Exposure System (WEE 3)

- Edge Exclusion System with one Exclusion Ring Specify exclusion ring width 1 - 5 mm protection available

- Ionization Bars in Chamber

- Seismic Bracket Kit

Configuration Options - 3D Packaging:

- Optical Focus                1

Configuration Options - Wafer Handling:

- Gen 4 Fanout 300: 300mm wafer size only

- 200mm and 300mm capability.

- Up to 4.0mm warpage for 300mm wafers (0.1 - 0.4Ib/mm stiffness)

- +/-1.2mm Warpage for 200mm wafers (0.9-1.1lb/mm stiffness)

Includes Dual Lip Seal Chuck, Enhanced Chuck Vac Sense, SW options (Multi-Zone EGA, Grid Focus, Single Probe Focus, & Step Specific Processing)