2016 Goepel XLine 3D - X-Ray + AOI

Goepel XLine 3D - X-Ray + AOI

• vintage 2016
• ore tubo 3560 (20.000 ore lavorabili dal produttore
• PCB width max.: 450 mm x 400 mm
• Inline
• +AOI 

Applications

The AXI systems from GÖPEL electronic are versatile. Standard tasks include the inspection of BGA, QFN, THT, LED and LGA solder joints. In addition, all other solder joints, whether visible or hidden, on a PCB can be inspected. Press-fit connectors are also inspected using the 3D planar CT process. During X-ray inspection, there are no AOI-typical reflections and shadows that could influence the inspection. The inspection is based on the absorption of the material which has different densities and thicknesses. The color and gloss level of a surface do not influence the X-ray inspection.