August NSX-90

Configuration: August NSX-90 is a macro defect inspection tool solution used through out the device manufacturing process. Macro defects (defects 5 micron and larger) can take place during wafer manufacturing, probing, bumping, dicing, or by general handling, and can have a major impact on the quality of a microelectronic device. The NSX-90 quickly and accurately detects yield-inhibiting defects, providing quality assurance and valuable process information. Original equipment specs are as follows: Camera and Optics: Review camera CCD : 3CCD Color Review camera Resolution : 752pixels*582 lines Second Camera CCD (Option): B/W Digitial Second camera Resolution : 1008pixels*1018 lines Objectives: 1.25X to 20X(Automated inspection ) Magnification at Review Monitor: 50X to 2000X Magnification for Second Camera at Monitor: 50X to 3000X(Depending on the photo eyepiece lens) Second Camera PE lenses:3.3x - Throughput: - 8”: ? 6.5 WPH - 6”: ? 8.2 WPH This unit is configured with Wafer handler for 8" wafers.