EVG Gemini Automated Production Wafer Bonder with Face to Face Alignment

EVG Gemini Automated Production Wafer Bonder with Face to Face Alignment Fully automated operation Interlocked doors with signal light tower 4 Axis Industrial Robot EVG CIM Framework Software GUI (Graphical User Interface) Flexible process flow definition Drag and drop recipe programming Parallel processing of multiple jobs Automated recording of process and machine parameters Throughput optimized handling sequence Password protected user access levels Open cassette loading with empty/present sensor Currently configured for 6" (150mm) wafers (4" and 8" optional with additional hardware) Qty 8 bond chucks included for 6" wafers, additional chucks can be offered SmartView®NT Alignment Module with 5x Objectives 4 Bond modules with up to 550°C and 10kN bond force Formic Acid Bubbler option for purging formic acid vapor into bond chamber 1 purge gas line for process gas CE Certified, All system documentation