SSEC 3302

Two wafer processing modules, acid processing.
 
Stainless steel construction.
 
Two wafer elevators.
 
PC controller.
Currently configured for 200mm wafer sizes
MFG Date: 2010
CE Marked
(2) 200mm Horizontal Open Cassette stations
Integrated wafer sensor & teaching system
Non-contact wafer alignment system (optical alignment)
Dual blade wafer handling robot (PVDF coated ceramic end-effectors)
Process Stations:
Molded (HALAR), Etch & Clean processing chambers
WaferChek real-time process monitoring & control
Chemical Delivery System:
(3) Programmable fan dispense arms w/100% surface coverage
ARM-1: DI:CO2
ARM-2: DI Rinse, Stream
ARM-3: electronic, heated, filtered, N2 blow assist
Programmable chamber wash w/DIW
Chamber wall dispense w/adjustable nozzle
Internal open & closed chemical collection ring (prog. separation, open, or closed)
N2 or CDA Heater for gas seal spindle tooling
Spindle system: programmable, brushless direct drive closed loop spin motor
PC controlled chemical mixing for DI:CO2 solution
Non-contact resistance monitor for fresh DI:CO2 dilution feedback
PC programmable DI:CO2 re-circulation system
DI:CO2 re-circulation cleanliness & temperature control
(2) Automatic, programmable pressure & flow control systems – 1 per process chamber
Programmable flow rate monitoring systems
Programmable Chemical counting systems
SQL Process view Package
SECS II/GEM interface
Host emulation software – SECS II/GEM data collection on local PC as “Host”

Damaged / Missing Parts: None reported. Please inspect to confirm
Note: This tool is in new condition. It was installed & set-up in a new lab for development
but, was never used