SSEC 3302

Two wafer processing modules, acid processing.   Stainless steel construction.   Two wafer elevators.   PC controller. Currently configured for 200mm wafer sizes MFG Date: 2010 CE Marked (2) 200mm Horizontal Open Cassette stations Integrated wafer sensor & teaching system Non-contact wafer alignment system (optical alignment) Dual blade wafer handling robot (PVDF coated ceramic end-effectors) Process Stations: Molded (HALAR), Etch & Clean processing chambers WaferChek real-time process monitoring & control Chemical Delivery System: (3) Programmable fan dispense arms w/100% surface coverage ARM-1: DI:CO2 ARM-2: DI Rinse, Stream ARM-3: electronic, heated, filtered, N2 blow assist Programmable chamber wash w/DIW Chamber wall dispense w/adjustable nozzle Internal open & closed chemical collection ring (prog. separation, open, or closed) N2 or CDA Heater for gas seal spindle tooling Spindle system: programmable, brushless direct drive closed loop spin motor PC controlled chemical mixing for DI:CO2 solution Non-contact resistance monitor for fresh DI:CO2 dilution feedback PC programmable DI:CO2 re-circulation system DI:CO2 re-circulation cleanliness & temperature control (2) Automatic, programmable pressure & flow control systems – 1 per process chamber Programmable flow rate monitoring systems Programmable Chemical counting systems SQL Process view Package SECS II/GEM interface Host emulation software – SECS II/GEM data collection on local PC as “Host” Damaged / Missing Parts: None reported. Please inspect to confirm Note: This tool is in new condition. It was installed & set-up in a new lab for development but, was never used