Strasbaugh 6EH nTrepid DIWO CMP Tool

Strasbaugh 6EH nTrepid DIWO CMP Tool Strasbaugh 6EH nTrepid DIWO CMP Tool for sale from a fab in Europe. It is now deinstalled. The tool was installed and initialized before being deinstalled due to a project cancellation. The Strasbaugh 6EH nTrepid DIWO CMP Tool will be released in late 2020. Please get in touch with gerard@tarasemi.com for more information. Please see configuration details below on this tool. Configuration: Silicon oxide, Poly-Si, a-Si Wafer: 150mm Location: Europe Available: Q3 2020 Status: Deinstalled, in storage. Condition: Tool was just initialized in fab, when tool was deinstalled due to cancellation of project. Tool in excellent condition and never put into production, like new. nTrepid is a 300-mm technology based fully automated, dry-in wet-out (DIWO), chemical-mechanical wafer

polishing system. Wafers will enter the system dry and be removed after polishing in a wet state. The

system has two main sections: the polishing and front end module (FEM) sections. Tables and turrets are

technically prepared in a way that allow an upgrade of the tool up to 300-mm-wafers. nTrepid is a fully automated, dry-in wet-out (DIWO), chemical-mechanical wafer polishing system. Wafers will enter the system dry and be removed after polishing in a wet state. The system has two main sections: the polishing and front end module (FEM) sections. The polishing section has load and unload stations, two main polishing platens, rinse station, and buff table. The two main tables have slurry and deionized water delivery and pad conditioning systems. The buff table has DIW delivery system. Two spindle assemblies rotate about a central turret and use wafer carriers to move the wafers to each station per pre-programmed flows. User-specified recipes are executed at each station for polishing and rinsing the wafers. The system will utilize an interfaced endpoint detection system to monitor film transition and thickness during polishing on the main two tables. The FEM section provides the automatic input and output location for wafers entering and exiting the system. It contains the following wafer stations: Open cassette loaders, wet wafer output basin with cart interface mechanism, wet/dry transfer station, and wet buffer station. A robot is used to move wafers to and from each station, as well as into and out of the polishing section. Wafers in cassettes are loaded into the machine at the OCL’s and exit the machine in cassettes in the wet output basin. A cart is used to dock with the machine for wet basin insertion and removal. The wet buffer provides temporary wafer storage to allow continuous operation when the wet basin is not available or is being replaced. Wafer Size Capabilities: 150mm round wafers - 1 Flat only, Flat length = 57.5mm +/- 2.5mm Wafer thickness #1 = 680 microns +/- 15 microns Wafer thickness #2 = 380 microns +70/-10 microns nVision Endpoint Detection: Tables 1 and 2 are equipped with following types of endpoint detection: > Optical (using Smartpad) / Table motor current / Pad temperature Spindles A and B are equipped with spindle motor current endpoint Electrical 208 Volt / 3 Phase / 50 to 60 Hertz Main circuit breaker: 150 Amps FLA (Full Line Amperage): 80 Tool Size:

Length x Width = 11ft-11in x 6ft-7in, 79 square feet (3.64x2.02 meters, 7.35 meters^2) Height = 7ft-8in (2.30 meters)

Weight: 5000 Kg Computing Platform:

• Industrial PC running Windows XP and Adventa ControlWORKS for Graphical User Interface, recipe editing and execution, event scheduling, and material tracking
• Giddings and Lewis Programmable Logic Controllers (PLC’s) for real-time movement control