2015 LAM 2300e5 Exelan Flex FX

-Dielectric Etch

-Etch/Ash/Clean - Plasma Processing

Equipment details:

Date of Manufacture: 2015

Currently Configured for: 300mm

Current Equipment Status: Installed in line

Asset HDD not included

Tool config is based on original PO, please verify tool details at tool inspection

Model No. 2300e

FI SN: 1017439-15-25-1496

Model No. Flex FX Series

Ch1 SN: FLEX-331(F157417-PM1)

Ch2 SN: FLEX-332(F157417-PM2)

Ch3 SN: FLEX-333(F157417-PM3)

Ch4 SN: FLEX-334(F157417-PM4)

Ch5 SN: FLEX-335(F157417-PM5)

Process: Oxide

Software Version: 1.8.4 SP11-HF5

System Power Rating: 208 AC 3-Phase

Loading Configuration: 4 Load ports

Chm/Unit Position 1: 2300 Flex FX; Chemicals / Gases Used: C4F6, COS,

O2, CO, CH2F2, C4F8, CH3F, CHF3, H2, NF3, N2, CF4, Ar, C4F8

Chm/Unit Position 2: 2300 Flex FX; Chemicals / Gases Used: C4F6, COS,

O2, CO, CH2F2, C4F8, CH3F, CHF3, H2, NF3, N2, CF4, Ar, C4F8

Chm/Unit Position 3: 2300 Flex FX; Chemicals / Gases Used: C4F6, COS,

O2, CO, CH2F2, C4F8, CH3F, CHF3, H2, NF3, N2, CF4, Ar, C4F8

Chm/Unit Position 4: 2300 Flex FX; Chemicals / Gases Used: C4F6, COS,

O2, CO, CH2F2, C4F8, CH3F, CHF3, H2, NF3, N2, CF4, Ar, C4F8

Chm/Unit Position 5: 2300 Flex FX; Chemicals / Gases Used: C4F6, COS,

O2, CO, CH2F2, C4F8, CH3F, CHF3, H2, NF3, N2, CF4, Ar, C4F8

2300 System

Wafer Size: 300 mm wafers

Wafer Config: SEMI

Cassette Type: 25 Slot Cassette

Process Module Position and Quantity: 2300 Exelan Flex FX

Gas Box Type: JetStream

2300 Process Module

Maintenance Kits: Quick Clean Kit

Maintenance Kits: Quick Clean Kit w/ Electrode

Maintenance Kits: Liner Kit (Qty = QCK qty + QCK w/ Electrode qty)

Maintenance Kits: Pendulum Valve Clean Kit

Service Kits: Service Tool Kit

Service Kits: RF Maintenance Kit

Service Kits: VCI Test Probe

Service Kits: Two Stage Calibration Kit

Service Kits: Service Platform

Service Kits: Generator Cart

Chamber Type: 2300 Exelan Flex FX

2300 Exelan Flex FX Options

Chamber Enhancement: Adv. Temp Control

Electrode Gap: Adjustable Gap

Process Hardware Finish: Polished

Electrode Step: .16 Step

Upper Electrode Socket: Standard

Gas Feed: Adv. Top Plate 2-zone Gas Feed

Top Plate Enclosure: Vented Top Plate Enclosure

Top PI Chamber Manometer: Baffle

Advanced Confinement Control: ACC+

Gasket: Medium Power Gasket

Coupling Ring: Standard

Wafer Clamping Mechanism: EP-518

ESC Cooling: Dual Control, Dual Zone

Pin Lifter: Standard Temp

Wafer Lifter: Two Stage

Edge Rings: 35 Deg CER

Bias Match,2MHz Generator: 2Mhz High Power Pulsed

Bias Match,27MHz Generator: 27MHz Pulsed

Bias Match,60MHz Generator: 60Mhz Pulsed

300MM Turbo Pump: 2700 L/s BOCE

Endpoint Detection: Chamber Configurables, Optical Endpoint

Module Options: Bellow Removal Tool

PM Facilities : Dual Channel Chiller

PM Facilities Flow Rate: 10GPM

Coolant Hoses: High Pressure

TCU Leak Detection: Optical Coolant Leak Detector

Foreline Manometer: Heated

Foreline Heater: Non-Heated

Chamber Isolation Valve: Bonded Viton Barr. Seal Door 2

Vacuum Valve: Chemraz

Lower Isolation Valve: Viton Dry

Interconnect Hardware, Pump to TCU: Interconnect Cable Length

Interconnect Hardware, TCU to PM: Interconnect Cable Length

Interconnect Hardware, Pump to PM: Interconnect Cable Length

EMO Cable, TCU to RPDB: EMO Cable Length

EMO Cable, Pump to RPDB: EMO Cable Length

2300 Gas Box

Mounting Location: Transport Module

Door: Window

Primary Valve Options: Lock-out Tag-out Manual Valve

Facilitization: FIB

Facility Box Connection: Top Gas Connection

Facility Box Containment: Enhanced Containment

Facility Box Regulation: Tescom Regulator

Facility Box Filter: Nickel & SST(Gas Dependent)

Future PM: Position 1, 2, 3, 4, 5, 6

Inlet Pressure Measurement: Gauge Only

Gas System Exhaust: Top Exhaust

Gas System Option: IGS Tool Kit

Gas System Option: MFC Ergo Tool Kit

Gas System Option: Service Ladder

Gas System Option: Gas Box Hoist

Gas System Option: Upper Frame Lift Fixture

Gas System Option: AFVi

2300 Exelan Flex FX Gas Box Options

Process Gas Line Qty: Process Gas Line Qty _

Tuning Gas Options: 4

Heated Gas Lines: No Heated Gas Lines

Manifold Options: Multi-Exit (Pos 3 Exit)

AFVi Vacuum Weldments: Yes

Optional Gas Configuration: Custom Gas Lines

Gas Box Configuration

Gas Line 1: C4F6 200 sccm- STEC D219

Gas Line 2: COS 30 sccm - STEC D219

Gas Line 3: O2 20 sccm - STEC D219

Gas Line 4: CO 500 sccm - STEC D219

Gas Line 5: CH2F2 200sccm - STEC D219

Gas Line 6: C4F8 200 sccm - STEC D219

Gas Line 7: O2 200 sccm - STEC D219

Gas Line 8: CH3F 100sccm - STEC D219

Gas Line 9: CHF3 200 sccm - STEC D219

Gas Line 10: H2 300 sccm - STEC D219

Gas Line 11: NF3 30 sccm - STEC D219

Gas Line 12: N2 500 sccm - STEC D219

Gas Line 13: CF4 200 sccm - STEC D219

Tuning Gas 4/Line 14: AR 1000 sccm - STEC D219

Tuning Gas 3/Line 15: O2 3000 sccm - STEC D219

Tuning Gas 2/Line 16: O2 20 sccm - STEC D219

Tuning Gas 1/Line 17: C4F8 20 sccm- STEC D219

2300e Platform

ATM, EFEM: 3 Wide or 4 Wide EFEM Type

ATM Front Fascia: Standard Front Fascia

ATM Front End Load Port: 3 or 4 FOUP TDK

ATM Cassette ID: Selection for Carrier ID

ATM Wafer ID: WIDS Bottom Read

ATM, Light Curtain: Select if Light Curtain is needed

ATM Factory Automation: OHT PIO Sensor

ATM Wafer Aligner: Wafer Aligner

ATM End Effector Contact Pads: Kalrez

ATM Input Buffer Station: 25 Slot

ATM Auxiliary Buffer Station: 25 Slot Buffer Station Type

ATM,CTC Computer, Storage: Hard Disk Drive - Mirrored

ATM Controls User Interface: Tool Monitor and Keyboard configuration

ATM Controls UPS Circuitry: Selection for system UPS circuitry

ATM Controls ELB: Selection for Earth Leakage Breaker

VTM Throughput: Standard

VTM Loadlock A: Select appropriate configuration for platform type.

VTM Loadlock B: Select appropriate configuration for platform type.

VTM Conditioning Station A: No Conditioning Station

VTM Conditioning Station B: No Conditioning Station

VTM 25 Slot Buffer-Lwr Aux: Yes

VTM 25 Slot Buffer-Lwr Align: Yes

VTM 25 Slot Buffer-Lwr Alcove: Select if Buffer Station is needed in the Lower

Alcove position

VTM 25 Slot Buffer-Upr Aux: No

VTM 25 Slot Buffer-Upr Align: No

VTM 25 Slot Buffer-Upr Alcove: No

VTM Clean Room Configuration: Defines tool will be configured for Ballroom

or Bulkhead

VTM Airlock Wafer Fingers: Stainless Wafer Fingers

VTM Robot: Standard

VTM Backing Pumps: Kashiyama

VTM Robot End Effector: Kalrez

Subpanel (RPDB): RPDB

Subpanel Interconnect Cables: TM to Subpanel

Signal Tower: R-O-G-B Signal Tower

Software, System Control: Software Version 1.X

Platform System Options: System Calibration and Alignment

Platform System Options: Service Step for PM

Platform System Options: Robot CDM

Platform System Options: VTM Robot Lift

Platform System Options: Ionizer Kit

Platform System Options: TM Vacuum Hand Held Module

Platform System Options: APCS

Platform System Options: Facility Interface Board

Platform System Options: EFEM Yellow Light

Platform System Options: ATM Robot Removal Kit

Software

Platform: APC Recipe Tuning from Host

Platform: LamState

Platform: Wafer Flow Tuning

Platform: TEK Software

Distrubuted UI: Distrubuted UI

Additional Software: 2nd HSMS

LamRAMP: LamRAMP

LamRAMP: Individual LamRAMP Options

LamRAMP Options: Remote Station

LamRAMP Options: Configuration Browser

LamRAMP Options: Recipe Browser

LamRAMP Options: Alarm Browser

Number of Unit License: Number of License

Number of Site License: Number of License

LamFAST: LamFAST

LamFAST: Individual LamFAST Options

LamFAST Options: Lam DataAnalyzer

LamFAST Options: Lam SpectraAnalyzer

LamFAST Options: Lam WaferViewer

Number of Unit License: Number of License

Number of Site License: Number of License

Automated Procedure and Maint: AutoPM

Simulator Plus: Simulator Plus

Data Management: Equipment Information Mgmt Pkg

Data Management: EIM Server (Primary)

Data Management: EIM Server (Secondary)

Data Management: EIM Server UPS

Damage/Missing parts list

Please inspect tool to reconfirm

Dry pumps and customer provided items not included on sales