2017 EVG 6200 NT

- Double side

- Manual handling

- Exposure Modes: Hard, Soft, & Vacuum Contact

- Separation Distance: 0 - 300 µm adjustable via software

- Wafer Thickness: 0.1 - 10 mm (For Top Side)

- Semi Automatic Loading with Mechanical Prealignment on Chuck

- Quick change of Mask and Chuck

- One Stage Rack for Up to 5 Aligner Tools

- EC Decleration of Conformity (Certification done by EVG)

- PC Controlled Operational Environment

- Solid State Drive and Hard Drive for High Availability and Reliability

- Graphical User Interface (GUI) for Visualization

- User Interface Including Keyboard and Monitor

- Granite Base Frame Construction and Active Vibration Isolation

2017 Vintage