2009 EVG 810LT, Low Temp Plasma Activation System
2009 EVG 810LT, Low Temp Plasma Activation System
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Description
- Equipment: Low Temp. Plasma Activation System for wafer bonding
- Maker: EVG (EVGroup)
- Model: EVG 810 LT
- Type: Manual Type
- EQP. Size(W*L*H): 1520*1210*1530 (mm)
- Wafer Size: 50 ~ 200mm
- Process : Silicon, Glass, GaAs, Etc
- Applicable for SOI, MEMS, compound semiconductors, and advanced substrates bonding
Substrate size
50 ~ 200mm
Specifications
| Manufacturer | EVG |
| Model | 810LT, Low Temp Plasma Activation System |
| Year | 2009 |
| Condition | Used |
| Stock Number | BM3995 |