CFM Technologies Full Flow CFM8050 Photo Resist Processing

Quantity 6 Tools available Set up for 8 Inch wafer processing With SMIF Load ports. Vintage 1995 Still Installed in FAB M/C 2,3,4, was used for frontend (pre-poly) pre- furnace cleans and was designated an undoped machines. M?c 1,2, 3 was used post poly patterning stages for pre-furnace cleans, post resist strip cleans and pre-metal dep cleans. were designated a doped system as it was used exclusively after poly patterning, although if you looked at the routine SCA check results from the two systems there was never any evidence of doping. In production they tended to restrict the pre-metal cleans to one module of M/C 1,2,3 and used the other for the post resist strip cleans.