2001 TEL ACT-12

Product : Clean Track System

Model : ACT-12 In-line System

Wafer Size : 8inch

1. DESCRIPTION

1-2. Left to Right

1-3. MODEL : Clean track ACT-12

1-4. WAFER & CARRIER TYPE : 8", Notch Type , 25 Slots

1-5. System Power Rating : AC 208V , 3-Phase for System , 300A(MAX)

1-6. Loading Configuration : 3 Loader Unicassete

1-7. Software Version : 1.18.001

1-8. Main controller : Type#3

2. Main system

1)Main frame with system controller

2) Carrier station

- Type: Normal Cassette Type

- 3 Cassette / 25 slots

3) Coater unit (2-1,2-2 Module)

- 4 dispense nozzle with temperature controlled lines for etch unit

- RRC Pump

- PR Suck-back Valve : Air operation Suck-back Valve (Total : 8ea)

- Rinse nozzle : back/ EBR / solvent bath for etch unit

- Rinse system : 3 liter 2Tank Buffer tank system

- Programmable side rinse

for PR nozzle(1, 2, 3, 4) - 8 bottles(1 bottle/1nozzle) in machine for each unit

for Thinner supply - CCSS

- Drain: Direct drain

4) Developer unit (3-1,3-2,3-3,3-4 Module)

- H nozzle(2ea) for each unit

- 1 stream nozzle for DI rinse and 2 points for back side rinse on each unit

- Developer system : 3 liter 2Tank Buffer tank system

- Developer temperature control system

- Drain: direct drain

5) I/F Wafer Stage Type : Nikon S204

6) Adhesion Unit 2EA

- 100% sealing closed chamber(Built-in hot plate)

- HMDS tank with float sensor in system

- HMDS supply : Local bottle

7) Low Temp Hot Plates (LHP) 5EA

8) Chill Plates (CPL) 6EA

9) Chilling Hot Plate Process Station (CHP) 4EA

10) 1 WEE (wafer edge exposure ) unit

- Wafer Type : Notch

11) TCP Unit 1EA

12) TRS Unit 2EA

13) Chemical Cabinet 1 : HMDS Chemical Cabinet & Solvent & DEV Solution Chemical Cabinet

14) Temperature&Humidity controller 2EA

- Type: ESA-8

15) TEMP Control Unit(TCU) 1EA

- Type: TEL OEM

16) AC Power Box

- AC200/220V , Full-load current 300A