2015 Rudolph Sonus 7800

Condition: “As is” 
Date of manufacture: 2015 

Wafer size 300mm 

Rudolph Technologies has introduced the SONUS

Technology for measuring thick films and film stacks

used in copper pillar bumps and for detecting defects,

such as voids, in through silicon vias (TSVs). Copper

pillar bumps are a critical component of many

advanced packaging technologies and TSVs provide a

means for signals to pass through multiple vertically

stacked chips in three dimensional integrated circuits

(3DIC). The SONUS Technology is non contact and

nondestructive, and is designed to provide faster, less

costly measurements and greater sensitivity to smaller

defects than existing alternatives such as X ray

tomography and acoustic microscopy.