2003 ASM AD-8912 Die Bonder

 Wafer Diameter Maximum 12" (300 mm)

 Wafer XY Table Travel (13” x 13”) 334 x 334mm

 Die Size (10 x 10 mil to 1000 x 1000 mil)

 Die Placement Accuracy XY (0.38 mil)8.38um

 Epoxy Fillet Height (<2/3 of die thickness)

 BLT typically 1 0.2mil die size (material dependent)

 Work holder Indexer (linear motor)

 Pick/Bond Head (Linear Motor)  Qty. 2

 Ejector System

 Wafer Handling System

 Vision System

 Dispensing system (Musashi Pump)

 Epoxy Writer System (Disposal Nozzle)

Current Status Working, Cleanroom