1996 TEL TE8500

Contact Etch

Tool Status Running Wafers 

Wafer Size 200 mm

Fab Section Etch

Asset Description TEL 8500 OXIDE ETCHER

Software Version VER 1.0

CIM SECS

Process CMOS

Main System TOOL 1

Factory Interface SMIF 2 

DRY PUMP 3

RF RACK 1

CHILLER 1

AC RACK 1