2006 Rudolph MP200 Contactless Metal Thickness Measurement

Description

• MP200 double path tool
• non copper tool; double path tool delay stage;
• 6 inch chuck
• Cooling Water Required Minimum Flow: 0.79 GPM (3.00 l/m)   
• Minimum Temperature: 12 ºC (54 ºF, 285.00 ºK)    
• Maximum Temperature: 20 ºC (68 ºF, 293 ºK)
• Operating Air Pressure 14.00 PSI (96,534.20 N/sq m)
• Vacuum Required 0.98 in Hg (24.89 mm Hg)
• Contactless metal thickness measurement
• Wafer Size Range 150mm - 200mm
• Multi-Layer Film Capacity: YES
• Micro Spot Optics: YES
• Wafer Mapping: YES
• Controller Type: PC Controller Type
• External Cooling: Water Cooled
• Cooling Water Required: Minimum Flow: 0.79 GPM (3.00 l/m) Minimum Temperature: 12 ºC (54 ºF, 285.00 ºK) Maximum Temperature: 20 ºC (68 ºF, 293 ºK)
• Operating Air Pressure: 14.00 PSI (96,534.20 N/sq m)
• Vacuum Required: 0.98 in Hg (24.89 mm Hg)
• Condition: Good
• Year of Manufacture: 2006