Hanmi EMI Shield Tape Laser Cutting 1.0
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Description
- Wafer Size: 300
- Group: Electronic
- Category: Semiconductor Assembly & Packaging
- Family: Dicing Saws/Scribes
- Type: Dicing Saw
- Manufacturer: HANMI
Specifications
| Manufacturer | Hanmi |
| Model | EMI Shield Tape Laser Cutting 1.0 |
| Condition | Used |
| Stock Number | BM3216 |