Disco DFD6361

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Description

  • Wafer Size: 300
  • Group: Electronic
  • Category: Semiconductor Assembly & Packaging
  • Family: Dicing Saws/Scribes
  • Type: Dicing Saw
  • Manufacturer: Disco


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Specifications

ManufacturerDisco
ModelDFD6361
ConditionUsed
Stock NumberBM3211