TEL ACT12-300 Dual Block Track

Recently powered off and still in the clean room and waiting for fixture for deinstall and rigging and crating.

Tool type: dual process block track

Wafer size: 300mm

Direction: right hand side

4 blocks interfaced; cassette, 2 process, & stepper interface

4 wafer transfer robot arms; cassette, 2 process, & stepper interface

Control module on cassette end station (CES)

3 station 25 wafer FOUP

Interface is to Ultratech T-300

Cassette rotators and platforms

Facility sensors for DI water and Caustic exhaust

Coater (PCT)- qty 2

2 nozzles with temp. control

Chuck vacuum sensor

Millipore P-250 pumps

SS 0.3mm diameter side rinse nozzle w/ flow meter

1 set of 2 SS 0.3mm diameter back rinse nozzles

1 SS 0.3mm diameter back rinse nozzle for chemical 1

1 SS 0.3mm diameter back rinse nozzle for chemical 2

Bulk-Fsi system for side and back rinse

PTI mass flow controller per module

PP cup w/ sensor

Chuck up VAC off switch

Addition of drip trays

Developer (DEV)- qty 3

1 "H" nozzle w/ temp control per cup

Bulk- FSI system for developer

PP cup w/ sensor

Chuck vacuum sensor

Chuck up VAC off switch

Chill Plate Process Station (CPL)- qty 4

Hard anodized aluminium oxalic acid treated surface plate AL

Temp control

0.1mm C ring fixed type and spacer type stainless & polyimide proximity pins

Dual-band alarm function

Transfer Chill Plate (TCP) qty 1

Hard adonized aluminium oxalic treated surface plate Al

0.1mm c ring fixed type and spacer type stainless & polyimide proximity pins

Adhesion Process Station (ADH) qty 1

Half-sealed chamber w/ dispersion plate for HDMS

Dual-band alarm function

10L canister w/ bubble sensor

Heated Cover High Exhaust Low Temp Hot Plate Process Station (HCH)- qty 6

N2 purge capability

High Volume exhaust

Mist traps

SS insulated heated exhaust cover w/ cover interlock

Hard anodized aluminium oxalic acid treated Al surface plate

Temp control

0.1mm C ring fixed type and spacer type stainless & polyimide proximity pins

dual-band alarm function

Individual thermo-switch for overheating detection

Interface Block qty 1

Single- pincette shared wafer transfer w/ centering guides; standard wafer arm and interface panel to accommodate Ultratech T-300 (may vary)

Interface must include a CPL for insuring consistent wafer temps into the stepper; (IFCPL)

Buffer cassette; 26 wafer capability

Wafer out sensor

WEE requires 435nm spectrum for G-line application

TEL temp and humidity controller- 2

Fluid Temperature Controller- 1

Chemical cabinet- 1

DI H2O facility sensors

4- 1gal C4 bottles w/ recirculation feature

2- 20L reserve tank s w/ 2- 3L buffer tanks for solvent

2- 20L reserve tank s w/ 2- 3L buffer tanks for develop

300CC L/E for solvent

8- 200cc L/E for C4

1- solvent panel

1- develop panels

2- auto change air valves

AC power box- 1