2005 SSEC 3300 Wafer clean

150mm and 200mm Capable

Post DRIE etch TSV cleaning is essential to the reliability of 2.5D and 3D IC devices. SSEC’s proprietary

soak and spray technology minimizes spray time and chemistry use for lower cost-of-ownership than

conventional wet bench or single spray approaches; it achieved 100% photoresist and sidewall

fluoropolymer removal 5x faster than spray only.

The tool features equal-time soak software for process control. Each wafer soaks in heated, recirculating

solvent long enough to penetrate the polymer residue. Following wet transfer to the spray station, the

wafer is subject to a high-pressure spray to rapidly remove remaining residue. The result is 100%

photoresist and polymer removal. Soak and spray takes 88% less time and 77.5% less chemistry than

spray-only processes.