2006 DNS SS 3000-AR

Wafer size 12"

Process WAFER SCRUBBER

1) SYSTEM COMPOSITION

SS 3000-AR 4 BACK SIDE

1: Load Port 3

2: INDEX UNIT 1

3: MAIN BODY 1

4: POWER BOX 1

2) GENERAL SPEC

WAFER TYPE THICKNESS DIAMETER

MAIN PRESSURE ALARM DI,AIR,EXH,N2,C02

PROCESS FORMULA

BRUSH NOZZLE: UNIT-3,4,5,6

N2 MASS FLOW: UNIT-3,4,5,6 NANO SPRAY Nozzle

DI FILTER(4EA:0.05um): UNIT-3,4,5,6

SPIN CHUCK TYPE: MAGNETIC CHUCK TOTAL 6EA (LOCK,UN LOCK 2EA)

WAFER SENSOR: WAFER DETECTOR SENSOR 4EA

REVERSE UNIT: UNIT-7,8 REVERSE UNIT-1,2

ULTRA SONIC FLOW METE: DIW,BACK RINSE,SPRAY NOZZLE,BRUSH RINSE

E-FLOW: UNIT-3,4,5,6 NANO SPRAY Nozzle

NANO SPRAY NOZZLE: 1 NOZZLE

DI RINSE NOZZLE: 2 Front Rinse Nozzle

DI BACK RINSE NOZZLE: 1 BaCk Rinse Nozzle

3)SYSTEM

HOST H/D: 2 H/D

MAIN PC H/D: 2 H/D

HUB BOX: MISSING

LOAD PORT SENSOR: AREA SENSOR USE

IONIZER: INDEX POSITION

4. MISSING PART

I/D: I/F BOARD 4EA

I/D: INDEXER SLAVE CONTROLLER 1EA

I/D: INDEXER DC POWER SUPPLY BOX 1EA

I/D: MAIN I/O DIVISION BOX 1EA

I/D: SAFETY RERAY BOX 1EA

SYSTEM: HUB BOX ASS'Y