KLA TENCOR Surfscan SP3 Defect and Surface Quality Inspection Systems – UDL/UDK

KLA SP3 Main Components -

• Integrated Console

• Bare Wafer Inspection Station

• Equipment Front End Module (EFEM)

• 3 Port Wafer Loading Unit

Description of Inspection System -

• Un-patterned wafer inspection platform to incorporate deep-ultraviolet (DUV) illumination. Deep Ultraviolet (DUV) source

• DUV-specific apertures to enable defect capture on un-patterned thin films

• High speed stage and advanced imaging computer for enhanced productivity

• Full-wafer high-resolution haze maps

Defect Detection and Classification Capabilities

• Designed to capture a broad range of challenging defects for 32nm/22nm process nodes

• High-productivity rapid automated defect classification

• Coordinate accuracy to enable rapid defect re-detection and review

• Integrated, high resolution (~100 mega-pixel), full-wafer SURFmonitor™ haze maps, providing automated capture of ultra-fine slip lines and scratches or maps of surface roughness, grain size and other process parameters

• Surfscan SP3 system feature dramatic advances in sensitivity and throughput over their industry-benchmark predecessor, the Surfscan SP2XP

• Inspection Module for the back side of wafers for defects that might deform the wafer shape.