2003 Leica INS 3300 DUV

Leica INS3300 is the most advanced solution in the production control of 200 mm and 300 mm wafers.

This compact modular inspection system is extremely flexible.

One of its unique features is the multi-wavelength imaging capability.

The system masters all applicable imaging modes down to DUV (248 nm).

The combination of the DUV AT high performance optics combined with

a new handling concept guarantees impressively high throughput even

at the highest resolution modes.

INS3300DUV Inspection Station

Vintage 2003,

Features / Equipment:

Encapsulated system with

Fully automatic microscope for 300mm and 200mm wafer

Motorized 6x nosepiece

Laser Autofocus LFS

Automatic Beamsplitter for

Automatic contrast switching etc.

Vibration decoupling

Lenses for bright/dark field/DIC

Objective 5x/0.10 BD

Objective 10x/0.30 BD

Objective 20x/0.50 BD

Objective 50x/0.85 BD

Objective 100x/0.90 BD

Objective DUV 150x/0,90 AT brightfield (248 nm)

INS3300 control panel with integrated joystick / trackball

X/Y-table

High Speed precision scanning stage 300x300mm

Illumination Deep Ultra Violet (248nm)

Lamphouse 105/106Z (HG 100)

Illumination VIS

Lamphouse 105/106Z halogene

Robot wafer transport system

3x waferchanger

Prealigner

Non contact Prealignment

Loadports FIXLOAD V6 Brooks 300mm

Signal tower

System controller INS3300 with installed

Software Viscon NTImage Capturing Module

3 chip video camera Sony, with cable set

1 chip video camera DUV

Service Refurbishment incl.

preliminary acceptance in our house

Acceptance at your premises (following the Leica Acceptance Procedure)

Warranty 3 months

Lead time 10 ~ 12 Weeks