2006 Applied Materials Endura II Liner/Barrier
2006 Applied Materials Endura II Liner/Barrier
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Description
Applied Materials Endura II Liner/Barrier PVD (Physical Vapor Deposition)
Currently Configured for 300mm wafer size
MFG Date: January, 2006
EQUIPMENT DETAILS:
Tool is operating in clean room.
‘Equipment is located in cleanroom and is schedule for deinstallation by [VENDOR
NAME]. Buyer is responsible for $X,XXX.XX in de-installation costs payable to . Buyer is
also responsible for packaging, crating, loading and shipping’
A HARD DISK DRIVE WILL BE REMOVED FROM TOOL.
[Chamber 2]
For Ti PVD chamber
DCPS;OPTIMA DCG-200,ENI,for PVD
PUMP/CRYO,OBIS,HELIX
HT ESC type stage
Ar;150/20sccm
[Chamber 3]
For TiN PVD chamber
DCPS;OPTIMA DCG-200,ENI,for PVD
PUMP/CRYO,OBIS,HELIX
A101 type stage
Ar/N2;150/200sccm
[Chamber 4]
For TiN PVD chamber
Specifications
Manufacturer | Applied Materials |
Model | Endura II Liner/Barrier |
Year | 2006 |
Condition | Used |
Stock Number | em1192 |
WAFER SIZE | 300mm |