2006 SSEC M3303 Lift off Process

2006 SSEC M3303 Lift off Process

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Description

The HPC is for the solvent lift off process – 500-2300psi / The cleaning of the Wafers takes place in the HVS (high velocity spray) chamber up to 40psi 

Specifications

ManufacturerSSEC
ModelM3303 Lift off Process
Year2006
ConditionUsed
Stock NumberGOD23082023720223437