KLA 2132 Wafer Inspection System

Serial number W21XX639 can be sold "as is" or operational to oem specs. Deinstalled by KLA, Warehoused, barrier bagged. The system was deinstalled in september 2002 and until that date was upgraded with various hardware and software upgrades.
Facilities: 120v 3 phase 25A per phase
KLA2132 Board Configuration
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MAIN CARD CAGE
DP 710-683424-001 REV AA
DF 710-661726-00 BD1
API 710-658036-00 REV C1
API 710-658041-20 REV E0
UP 710-658046-00 REV F0
XINT 710-658176-00 REV A0
YINT 710-658172-00 REV H0
XINT 710-658176-00 REV A0
YINT 710-658172-00 REV H0
CT 710-655651-20 REV C0
CT 710-655651-20 REV C0
MM 710-659412-00 REV C0
MM 710-659412-00 REV C0
MC 710-658232-20 REV H0
IF1 710-658086-20 REV E0

AUXILIARY CARD CAGE
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DF 710-678525-001 REV AB
DD 710-650044-20 REV DB0
DP 710-678545-00 REV B1
RTF 710-652840-20 REV D3
710-659485-20 REV??

General Description
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The KLA 2132 is capable of inspecting at the following rates:
Sensitivity: 0.62 ------- Speed: 5 sec/cm2
Sensitivity: 0.39 ------- Speed: 15 sec/cm2
Sensitivity: 0.25 ------- Speed: 30 sec/cm2
and includes the following:-
wafer inspection module for 4, 5, 6 or 8 inch wafer size
SUBSTRATES: For silicon wafers conforming to SEMI standard M1.1
Wafer diameter (mm): 100 100 125 150 200
Wafer thickness (?m): 525 625 625 675 725
SENSITIVITY AND INSPECTION SPEED:
Die to Die Mode
Sensitivity (um) Speed (sec/cm2)
0.60 05
0.50 1.5
0.40 15

Cell to Cell Mode
Sensitivity (um) Speed (sec/cm2)
0.30 05
0.25 30
0.20 15
Full performance specifications are available on request