EVG Gemini Automated Production Wafer Bonder with Face to Face Alignment

EVG Gemini Automated Production Wafer Bonder with Face to Face Alignment

Fully automated operation
Interlocked doors with signal light tower
4 Axis Industrial Robot
EVG CIM Framework Software GUI (Graphical User Interface)
Flexible process flow definition
Drag and drop recipe programming
Parallel processing of multiple jobs
Automated recording of process and machine parameters
Throughput optimized handling sequence
Password protected user access levels
Open cassette loading with empty/present sensor
Currently configured for 6" (150mm) wafers (4" and 8" optional with additional hardware)
Qty 8 bond chucks included for 6" wafers, additional chucks can be offered
SmartView®NT Alignment Module with 5x Objectives
4 Bond modules with up to 550°C and 10kN bond force
Formic Acid Bubbler option for purging formic acid vapor into bond chamber
1 purge gas line for process gas
CE Certified, All system documentation