Plasmalab 100 PECVD
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Description
150 mm and 200 mm
De-installed, warehoused.
Can be inspected by appointment.
Used for SiN processing.
A) Wafer size:6"~ 8" silicon wafer
B) Temperature:< 390 °C
C) For SiN X film:
a) deposition rate:>600 A/min
b) film stress:<+- 300 MPa
c) uniformity:<10%
D) For SiO X film:
a) deposition rate:>2000 A/min
b) film stress:<+- 300 MPa
c) uniformity:<10%
Includes the following pumps:
Alcatel 2015C2 qty 2
Alcatel ADS602P qty 1
Leybold D16BCS qty 1
De-installed, warehoused.
Can be inspected by appointment.
Used for SiN processing.
A) Wafer size:6"~ 8" silicon wafer
B) Temperature:< 390 °C
C) For SiN X film:
a) deposition rate:>600 A/min
b) film stress:<+- 300 MPa
c) uniformity:<10%
D) For SiO X film:
a) deposition rate:>2000 A/min
b) film stress:<+- 300 MPa
c) uniformity:<10%
Includes the following pumps:
Alcatel 2015C2 qty 2
Alcatel ADS602P qty 1
Leybold D16BCS qty 1
Specifications
| Manufacturer | Plasmalab |
| Model | 100.0 |
| Year | 2003 |
| Condition | Used |
| Stock Number | OD201220174 |