Okamoto Grind-X GNX-300P Grinder
Okamoto Grind-X GNX-300P Grinder
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Description
Okamoto Grind-X GNX-300P Grinder
(Vintage : 2001, condition : No Missing, but No polisher)
This unit is located in Asia and is stored in Warehouse.
This unit was in working condition before de-install.
Configuration:
Wafer diameter: 8" and 12"
Grinding mode: Continuous down feed
Grinding spindle: 2 axes
Rotation speed: 3,000 rpm maximum
Bearing: air bearing
Motor: 5.5 kW built-in motor
Cooling method: water-cooled
Maximum vertical stroke: 4"
Vertical fast-grind speed: 8" per minute
Grinding speed: 1 to 999 um per minute
Grinder diameter: 12"
Grinding resistance reading: monitoring current, output to CRT
Horizontal angle adjustment: manual
Maximum radial load capacity: 30 kgf
Maximum axial load capacity: 150 kgf
Air consumption: 20 L per minute x 2
Index table:
Number of vacuum chucks: (3)
Vacuum chuck material: porous ceramic
Vacuum chuck rotation motor: 1.0 kW AC servo motor x 3
Vacuum chuck rotation speed: 400 rpm maximum
Chuck bearing: air bearing
Maximum radial load capacity: 30 kgf
Maximum axial load capacity: 150 kgf
Air consumption: 36 L per minute x 3
Auto measuring device:
Wafer thickness measurement method: Two-point in-process gauge
Wafer thickness setting method: final
Wafer thickness displaying range: 1.8 mm
Table cleaning unit:
Cleaning method: water and ceramic ring
Wafer cleaning unit:
Cleaning method: water and brush
Operation panel:
Display method: 15" TFT color touch panel
Power supply:
Input power: 200V +/- 10%, 3 phase, 50 / 60 Hz
Power consumption: 20 kVA
Grounding: ground resistance JIS type 3 100 ohms or lower
Air supply:
Consumption: 160 NL per minute
Pressure: 0.49 to 0.78 MPa
Dew point: -15°C or lower
Oil removal rate: 0.1 PPM W / W
Grinding water
Water used: DI water
Pressure: 0.34 to 0.49 MPa
Flow rate: 10 L per wafer
Cooling water for vacuum pumps and spindles:
Water used: city water
Pressure: 0.19 to 0.49 MPa
Flow rate: 10 NL per minute
Mist separator duct / general exhaust: Exhaust rate:
2 m^3 per minute
Connection: duct hose, 4" outer diameter
Vacuum pump duct / general exhaust:
Exhaust rate: 75/90 m^3 / h, 50 / 60 Hz
Connection: duct hose, 4" outer diameter
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Tarasemi are a Leading supplier of used Semiconductor Equipment, Surface Mount equipment, ATE equipment, Scientific and Laboratory equipment.
We can supply used semiconductor equipment in excellent working condition including refurbishment and installation. We can offer you a turnkey solution at competitive prices.
We also have a large inventory of Spare parts; we can source obsolete and difficult to source parts and offer second source parts.
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(Vintage : 2001, condition : No Missing, but No polisher)
This unit is located in Asia and is stored in Warehouse.
This unit was in working condition before de-install.
Configuration:
Wafer diameter: 8" and 12"
Grinding mode: Continuous down feed
Grinding spindle: 2 axes
Rotation speed: 3,000 rpm maximum
Bearing: air bearing
Motor: 5.5 kW built-in motor
Cooling method: water-cooled
Maximum vertical stroke: 4"
Vertical fast-grind speed: 8" per minute
Grinding speed: 1 to 999 um per minute
Grinder diameter: 12"
Grinding resistance reading: monitoring current, output to CRT
Horizontal angle adjustment: manual
Maximum radial load capacity: 30 kgf
Maximum axial load capacity: 150 kgf
Air consumption: 20 L per minute x 2
Index table:
Number of vacuum chucks: (3)
Vacuum chuck material: porous ceramic
Vacuum chuck rotation motor: 1.0 kW AC servo motor x 3
Vacuum chuck rotation speed: 400 rpm maximum
Chuck bearing: air bearing
Maximum radial load capacity: 30 kgf
Maximum axial load capacity: 150 kgf
Air consumption: 36 L per minute x 3
Auto measuring device:
Wafer thickness measurement method: Two-point in-process gauge
Wafer thickness setting method: final
Wafer thickness displaying range: 1.8 mm
Table cleaning unit:
Cleaning method: water and ceramic ring
Wafer cleaning unit:
Cleaning method: water and brush
Operation panel:
Display method: 15" TFT color touch panel
Power supply:
Input power: 200V +/- 10%, 3 phase, 50 / 60 Hz
Power consumption: 20 kVA
Grounding: ground resistance JIS type 3 100 ohms or lower
Air supply:
Consumption: 160 NL per minute
Pressure: 0.49 to 0.78 MPa
Dew point: -15°C or lower
Oil removal rate: 0.1 PPM W / W
Grinding water
Water used: DI water
Pressure: 0.34 to 0.49 MPa
Flow rate: 10 L per wafer
Cooling water for vacuum pumps and spindles:
Water used: city water
Pressure: 0.19 to 0.49 MPa
Flow rate: 10 NL per minute
Mist separator duct / general exhaust: Exhaust rate:
2 m^3 per minute
Connection: duct hose, 4" outer diameter
Vacuum pump duct / general exhaust:
Exhaust rate: 75/90 m^3 / h, 50 / 60 Hz
Connection: duct hose, 4" outer diameter
[av_contact email='gerard@tarasemi.com' title='Request a Formal Quote' button='Send' on_send='' sent='Your message has been sent!' link='manually,http://' subject='' autorespond='' captcha='' color='']
[av_contact_field label='Name' type='text' options='' check='is_empty' width=''][/av_contact_field]
[av_contact_field label='E-Mail' type='text' options='' check='is_email' width=''][/av_contact_field]
[av_contact_field label='Subject' type='text' options='' check='is_empty' width=''][/av_contact_field]
[av_contact_field label='Message' type='textarea' options='' check='is_empty' width=''][/av_contact_field]
[/av_contact]
Tarasemi are a Leading supplier of used Semiconductor Equipment, Surface Mount equipment, ATE equipment, Scientific and Laboratory equipment.
We can supply used semiconductor equipment in excellent working condition including refurbishment and installation. We can offer you a turnkey solution at competitive prices.
We also have a large inventory of Spare parts; we can source obsolete and difficult to source parts and offer second source parts.
Follow us on Twitter
Like us on Facebook
Sign up for our mailing list here to get updates on our latest semiconductor equipment offerings
Specifications
Manufacturer | Okamoto |
Model | Grind-X GNX-300P |
Year | 2001 |
Condition | Used |
Stock Number | god130620171 |