ASM Wafer Die Sorter MS899-DL

ASM Wafer Die Sorter MS899-DL
Equipment Description
ASM
Model Number: MS899-DL
Year: August 2008
Cycle Time: 175ms
XY Placement: +/- 1.5 mil
Die Rotation: +/- 3degrees
Collect type: Surface pick type
Pick/Bond force: 40 - 250 g (adjustable)
Bin frame capability: Max 150
100 - buffer bin cassette
25 - empty bin cassette
25 - finished bin cassette
Bin Frame Size: 175 mm (I.D.) / 195 mm (O.D.)
Effective binning area: 58 x 58 mm2
Size of mylar sheet: 195 x 195 mm2
Wafer loader capacity: Disco Ring 25 / Foton Ring 12
Die Size Handling w/look ahead - 9 x 9 mil2 - 50 x 50 mil2 (0.23 x 0.23 mm2 - 1.27 x 1.27 mm2)
Die Size Handling w/o look ahead - 9 x 9 mil2 - 150 x 150 mil2 (0.23 x 0.23 mm2 - 3.81 x 3.81 mm2)
Package Size handling w/look ahead - 240 x 240 mil2
Package Size handling w/o look ahead - 480 x 480 mil2
Dimensions: 1448mm x 1486mm x 1626 mm
Weight: 100 kg

Power Requirements: 110 Volt -  50/60 Hz