Hitachi CM-700X Sip Mounter

Hitachi CM-700X Sip Bonder
Hitachi CM-700X Sip Bonder for sale by Tarasemi.com. Selling as is with the option to refurbish it. Contact gerard@tarasemi.com for an RFQ.



1,Hight Speed , High Accuray CSP/LOC/Sip DieBonder
2, Applicable for 200mm and 300mm wafers
3,High Speed Bonding, up to 3000UPH
4,Samall footprint
5,Aplicable for BOC,uBGA,and LOC,Sip package
6, Die Placement Accracy +/-36um(6 sigma)
Subsequent Iamination of die  rows can be accomplished after die placement:
lamiantion takes place at a Separate lamination Station



Tarasemi  are a Leading supplier of used Semiconductor Equipment, Surface Mount equipment, ATE equipment, Scientific and Laboratory equipment.

We can supply used semiconductor equipment in excellent working condition including refurbishment and installation. We can offer you a turnkey solution at competitive prices.

We also have a large inventory of Spare parts; we can source obsolete and difficult to source parts and offer second source parts.

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