HESSE & KNIPS, PIEZO BONDJET BJ820 WIRE BONDER

DESCRIPTION

Includes Hesse DA 04 051 Deep Access Bondhead & Light Tower; Number of Bonds Approx 37,054,610; Dimensions of Machine Approx 720mm x 1300mm x 1800mm High;

Specs:

• Fully Operational 4 Axis Rotary Bondhead Wedge-Wedge Bonder with Standard X & Y axis Table,
• Working Area 305mm x 410mm;
• Bonding is possible inside the following working area: X Axis:305mm, Y Axis: 410mm, Z Axis: 30mm, P Axis (rotational axis): 420 Degrees;
• Axis Repeatability 1 Micorn @ 3 Sigma;
• 2" Wire Spool Motorized Wire Feeder;
• Wire Dia Range 17.5 Micron - 60 Micron;
• Lost Wire & Wire Consumption Detection System;
• (4) Linear Motors & (1) Rotational Synchron-Servo Motor;
• Mini CCD Camera;
• Bondjet Pattern Recognition System;
• Leica MS5 Microscope;
• Keyboard & Trackball;
• Trivac D8B Pump & Motor;
• Serial number of machine: BJ820-198-0309.