2006 Rudolph MP200 Contactless Metal Thickness Measurement

2006 Rudolph MP200 Contactless Metal Thickness Measurement

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Description

Description

  • MP200 double path tool
  • non copper tool; double path tool delay stage;
  • 6 inch chuck
  • Cooling Water Required Minimum Flow: 0.79 GPM (3.00 l/m)   
  • Minimum Temperature: 12 ºC (54 ºF, 285.00 ºK)    
  • Maximum Temperature: 20 ºC (68 ºF, 293 ºK)
  • Operating Air Pressure 14.00 PSI (96,534.20 N/sq m)
  • Vacuum Required 0.98 in Hg (24.89 mm Hg)
  • Contactless metal thickness measurement
  • Wafer Size Range 150mm - 200mm
  • Multi-Layer Film Capacity: YES
  • Micro Spot Optics: YES
  • Wafer Mapping: YES
  • Controller Type: PC Controller Type
  • External Cooling: Water Cooled
  • Cooling Water Required: Minimum Flow: 0.79 GPM (3.00 l/m) Minimum Temperature: 12 ºC (54 ºF, 285.00 ºK) Maximum Temperature: 20 ºC (68 ºF, 293 ºK)
  • Operating Air Pressure: 14.00 PSI (96,534.20 N/sq m)
  • Vacuum Required: 0.98 in Hg (24.89 mm Hg)
  • Condition: Good
  • Year of Manufacture: 2006

Specifications

ManufacturerRudolph
ModelMP200 Contactless Metal Thickness Measurement
Year2006
ConditionUsed
Serial Number1-00-MPC-1505-AK-09
Stock NumberTara-124
Wafer Size150-200mm